We combine sophisticated test facilities and equipment with proven expertise in designing and manufacturing ceramic components. Click here to learn more.
- Forming methods include pressing, extrusion and tape casting
- Ceramic body types for mechanical/electrical product requirements
- Ability to produce complex geometries via additional machining
- Design processing available in Solid Works, Pro/E and AutoCAD
- Increased performance in high current & high voltage applications
- Parallel designs offer high capacitance and low ESR
- Series designs allow for high working voltages and tight tolerances
- Custom designs can incorporate both parallel and series elements
- Ideal for DC-DC power supply applications
- Capacitor assemblies with low ESR/ESL
- Leaded parts safeguard against thermal & mechanical stresses
- Designs available for both military and commercial markets
- Low profile, decreased assembly time over stand-alone elements
- Designs for Mil-Spec circular and D-sub connectors
- Capable of meeting various geometric and electrical configurations
- Complete electrical and mechanical testing
- Low inductance, non-polar
- Filtering and decoupling of high frequency applications
- Reliable, low profile, multi-layered designs
- Full range of temperature compensating bodies
- Used in EMI filtering and multi-pin connectors
- Small, lightweight, reliable, high dielectric strength
- Uniform insertion loss over a broad frequency range
- Feed-through and PI type configurations available
- Build to print or custom designs available to meet RF applications
- Variety of substrates and material deposition processes available
- Laser trimming and machining capability
- Complete electrical testing and custom packaging
|
|